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Manufacturer Part Number: max4947etg
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MAX4947ETG+
 Maxim Integrated Products 		$4.7709 Yes Yes Transferred 3 V YES 5.5 Ω 300 mΩ 800 ns 800 ns DPDT CMOS 3 3 70 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N24 Not Qualified e3 1 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 4 mm 800 µm 4 mm MAXIM INTEGRATED PRODUCTS INC QFN 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGD-1, TQFN-24 24 compliant EAR99 8542.39.00.01
MAX4947ETG+T
 Maxim Integrated Products 		Check for Price Yes Yes Transferred 3 V YES 5.5 Ω 300 mΩ 800 ns 800 ns DPDT CMOS 3 3 70 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N24 Not Qualified e3 1 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 4 mm 800 µm 4 mm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC24,.16SQ,20 24 compliant 8542.39.00.01
MAX4947ETG+T
 Analog Devices Inc 		Check for Price Yes Active 3 V YES 5.5 Ω 300 mΩ 800 ns 800 ns DPDT CMOS 3 3 70 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N24 Not Qualified e3 1 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 4 mm 800 µm 4 mm 24-LFCSP-4X4X0.75 24 24-LFCSP-4X4X0.75 2006-11-16 Analog Devices
MAX4947ETG/GG8
 Analog Devices Inc 		Check for Price Active 3 V YES 5.5 Ω 300 mΩ 800 ns 800 ns DPDT CMOS 5.5 V 2 3 70 dB COMMON OUTPUT 10 µA 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N24 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm QUAD 4 mm 800 µm 4 mm N/A 24 N/A 2006-11-16
MAX4947ETG/GG8
 Maxim Integrated Products 		Check for Price No No Transferred 3 V YES 5.5 Ω 300 mΩ 800 ns 800 ns DPDT CMOS 5.5 V 2 3 70 dB COMMON OUTPUT 10 µA 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N24 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm QUAD 4 mm 800 µm 4 mm MAXIM INTEGRATED PRODUCTS INC , compliant EAR99 8542.39.00.01
MAX4947ETG+
 Analog Devices Inc 		Check for Price Yes Active 3 V YES 5.5 Ω 300 mΩ 800 ns 800 ns DPDT CMOS 3 3 70 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N24 Not Qualified e3 1 85 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 4 mm 800 µm 4 mm ANALOG DEVICES INC 24-LFCSP-4X4X0.75 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGD-1, TQFN-24 24 compliant 24-LFCSP-4X4X0.75 2006-11-16 Analog Devices