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Parametric » Power Circuits » Power Management Circuits

Parametric results for: MAX6400BS26 under Power Management Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		MAX6400BS26+ Maxim Integrated Products
		MAX6400BS26-T Maxim Integrated Products
		MAX6400BS26+T Maxim Integrated Products

				Most Relevant								Technical				Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Threshold Voltage-Nom	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Yes

Obsolete

3 V

1.2 V

5.5 V

1

YES

NO

VOLTAGE SUPERVISOR/RESET IC

1

BICMOS

INDUSTRIAL

S-PBGA-B4

e3

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

1.1 mm

1.1 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

BUMP, UCSP-4

4

compliant

EAR99

8542.39.00.01

Check for Price

No

No

Obsolete

3 V

1.2 V

5.5 V

1.75 µA

+2.6V

1

YES

NO

VOLTAGE SUPERVISOR/RESET IC

1

BICMOS

INDUSTRIAL

S-PBGA-B4

e0

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

BGA4,2X2,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

500 µm

BOTTOM

1.1 mm

1.1 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

BUMP, UCSP-4

4

not_compliant

EAR99

8542.39.00.01

Check for Price

Yes

Yes

Obsolete

3 V

1.2 V

5.5 V

1.75 µA

+2.6V

1

YES

NO

VOLTAGE SUPERVISOR/RESET IC

1

BICMOS

INDUSTRIAL

S-PBGA-B4

e3

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

BGA4,2X2,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

1.1 mm

1.1 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

BUMP, UCSP-4

4

compliant

EAR99

8542.39.00.01

Compare

Maxim Integrated Products

Check for Price

Yes

Yes

Obsolete

3 V

1.2 V

5.5 V

1

YES

NO

VOLTAGE SUPERVISOR/RESET IC

1

BICMOS

INDUSTRIAL

S-PBGA-B4

e3

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

1.1 mm

1.1 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

BUMP, UCSP-4

4

compliant

EAR99

8542.39.00.01

Maxim Integrated Products

Check for Price

No

No

Obsolete

3 V

1.2 V

5.5 V

1.75 µA

+2.6V

1

YES

NO

VOLTAGE SUPERVISOR/RESET IC

1

BICMOS

INDUSTRIAL

S-PBGA-B4

e0

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

BGA4,2X2,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

500 µm

BOTTOM

1.1 mm

1.1 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

BUMP, UCSP-4

4

not_compliant

EAR99

8542.39.00.01

Maxim Integrated Products

Check for Price

Yes

Yes

Obsolete

3 V

1.2 V

5.5 V

1.75 µA

+2.6V

1

YES

NO

VOLTAGE SUPERVISOR/RESET IC

1

BICMOS

INDUSTRIAL

S-PBGA-B4

e3

Not Qualified

1

85 °C

-40 °C

4

PLASTIC/EPOXY

VFBGA

BGA4,2X2,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

1.1 mm

1.1 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

BUMP, UCSP-4

4

compliant

EAR99

8542.39.00.01