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Parametric results for: MPC850SEZT66 under Microprocessors

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Manufacturer Part Number: mpc850sezt66

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Select Parts		Part Number

		MPC850SEZT66 Motorola Semiconductor Products
		MPC850SEZT66 Motorola Mobility LLC

		Most Relevant		Technical			Compliance		Operating Conditions	Physical							Other
Composite Price	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price

Obsolete

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

COMMERCIAL

R-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

BALL

BOTTOM

MOTOROLA INC

BGA,

unknown

8542.31.00.01

Check for Price

Obsolete

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

COMMERCIAL

R-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

BALL

BOTTOM

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

256

Compare

MPC850SEZT66

Motorola Semiconductor Products

Check for Price

Obsolete

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

COMMERCIAL

R-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

BALL

BOTTOM

MOTOROLA INC

BGA,

unknown

8542.31.00.01

MPC850SEZT66

Motorola Mobility LLC

Check for Price

Obsolete

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

COMMERCIAL

R-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

BALL

BOTTOM

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

256