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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MPC852TCVR50A under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		MPC852TCVR50A Freescale Semiconductor
		MPC852TCVR50A NXP Semiconductors
		MPC852TCVR50A Rochester Electronics LLC

				Most Relevant							Technical									Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Yes

Transferred

32

50 MHz

32

32

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-256

256

compliant

3A991.A.2

8542.31.00.01

NXP

Yes

Obsolete

32

50 MHz

32

32

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-256

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

No

Yes

Active

32

50 MHz

32

32

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

ALSO REQUIRES 3.3V SUPPLY

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

COMMERCIAL

e1

3

245

30

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

ROCHESTER ELECTRONICS LLC

BGA

PLASTIC, BGA-256

256

unknown

Compare

Microcontrollers and Processors

Freescale Semiconductor

Yes

Yes

Transferred

32

50 MHz

32

32

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-256

256

compliant

3A991.A.2

8542.31.00.01

NXP

NXP Semiconductors

Yes

Obsolete

32

50 MHz

32

32

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e1

3

245

30

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-256

compliant

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

Rochester Electronics LLC

Check for Price

No

Yes

Active

32

50 MHz

32

32

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

ALSO REQUIRES 3.3V SUPPLY

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

COMMERCIAL

e1

3

245

30

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

ROCHESTER ELECTRONICS LLC

BGA

PLASTIC, BGA-256

256

unknown