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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: PCX755BVZFU400LE under Microprocessors

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Select Parts		Part Number

		PCX755BVZFU400LE Microchip Technology Inc
		PCX755BVZFU400LE Atmel Corporation
		PCX755BVZFU400LE Thales Group

		Most Relevant							Technical									Compliance		Physical								Dimensions			Other
Composite Price	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Obsolete

32

400 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

400 MHZ TO BE CONFIRMED

YES

FLOATING POINT

YES

YES

2.1 V

1.9 V

S-PBGA-B360

Not Qualified

360

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.77 mm

25 mm

25 mm

MICROCHIP TECHNOLOGY INC

25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

unknown

3A991.A.2

8542.31.00.01

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Transferred

32

400 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

400 MHZ TO BE CONFIRMED

YES

FLOATING POINT

YES

YES

2.1 V

1.9 V

S-PBGA-B360

Not Qualified

360

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.77 mm

25 mm

25 mm

ATMEL CORP

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Check for Price

Transferred

32

400 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

400 MHZ TO BE CONFIRMED

YES

FLOATING POINT

YES

YES

2.1 V

1.9 V

S-PBGA-B360

Not Qualified

360

PLASTIC/EPOXY

SQUARE

GRID ARRAY

BALL

BOTTOM

THOMSON-CSF SEMICONDUCTORS

,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Compare

PCX755BVZFU400LE

Microchip Technology Inc

Check for Price

Obsolete

32

400 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

400 MHZ TO BE CONFIRMED

YES

FLOATING POINT

YES

YES

2.1 V

1.9 V

S-PBGA-B360

Not Qualified

360

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.77 mm

25 mm

25 mm

MICROCHIP TECHNOLOGY INC

25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

unknown

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

PCX755BVZFU400LE

Atmel Corporation

Check for Price

Transferred

32

400 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

400 MHZ TO BE CONFIRMED

YES

FLOATING POINT

YES

YES

2.1 V

1.9 V

S-PBGA-B360

Not Qualified

360

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.77 mm

25 mm

25 mm

ATMEL CORP

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Microcontrollers and Processors

PCX755BVZFU400LE

Thales Group

Check for Price

Transferred

32

400 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

400 MHZ TO BE CONFIRMED

YES

FLOATING POINT

YES

YES

2.1 V

1.9 V

S-PBGA-B360

Not Qualified

360

PLASTIC/EPOXY

SQUARE

GRID ARRAY

BALL

BOTTOM

THOMSON-CSF SEMICONDUCTORS

,

unknown

3A991.A.2

8542.31.00.01

BGA

360