Parametric results for: S1213 under Other Telecom ICs
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SL3S1213FTB0
NXP Semiconductors
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Check for Price | Yes | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 500 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | unknown | 8542.39.00.01 | |||||
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SL3S1213FUF,003
NXP Semiconductors
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Check for Price | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | 265 µA | INDUSTRIAL | R-XUUC-N4 | Not Qualified | 85 °C | -40 °C | 4 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | NXP SEMICONDUCTORS | DIE-4 | compliant | NAU000 | |||||||||||||||
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SL3S1213FUF/G,005
NXP Semiconductors
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Check for Price | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | 265 µA | INDUSTRIAL | R-XUUC-N4 | Not Qualified | 85 °C | -40 °C | 4 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | NXP SEMICONDUCTORS | DIE-4 | compliant | NAU000 | |||||||||||||||
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SL3S1213FUD/G/BG,0
NXP Semiconductors
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Check for Price | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 265 µA | INDUSTRIAL | Not Qualified | 85 °C | -40 °C | DIE OR CHIP | NXP SEMICONDUCTORS | compliant | |||||||||||||||||||||||||||
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S1213
MACOM
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Check for Price | Contact Manufacturer | M/A-COM TECHNOLOGY SOLUTIONS INC | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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SL3S1213FUF
NXP Semiconductors
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Check for Price | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N4 | Not Qualified | 85 °C | -40 °C | 4 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | NXP SEMICONDUCTORS | DIE | DIE, | 4 | unknown | 8542.39.00.01 | ||||||||||||||||
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SL3S1213FUD/G/CH,0
NXP Semiconductors
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Check for Price | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 265 µA | INDUSTRIAL | Not Qualified | 85 °C | -40 °C | DIE OR CHIP | NXP SEMICONDUCTORS | compliant | |||||||||||||||||||||||||||
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S1213
Applied Micro Circuits Corporation
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Check for Price | Transferred | APPLIED MICRO CIRCUITS CORP | compliant | |||||||||||||||||||||||||||||||||||||
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SL3S1213FUD/BG,003
NXP Semiconductors
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Check for Price | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 265 µA | INDUSTRIAL | Not Qualified | 85 °C | -40 °C | DIE OR CHIP | NXP SEMICONDUCTORS | compliant | |||||||||||||||||||||||||||
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SL3S1213FTB0,115
NXP Semiconductors
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Check for Price | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | 265 µA | INDUSTRIAL | R-PDSO-N6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | TIN | NO LEAD | 500 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | unknown | SOT886 |