Findchips: Parametric Search Results for S29AL008J70BFI023


Select Parts		Part Number

		S29AL008J70BFI023 Cypress Semiconductor
		S29AL008J70BFI023 Infineon Technologies AG
		S29AL008J70BFI023 Spansion

				Most Relevant						Technical																									Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Package Description	Samacsys Manufacturer	Part Package Code	Pin Count

$1.9400

Yes

Transferred

8.3886 Mbit

8K,4K,16K,32K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

12 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

$2.0874

Yes

Active

8.3886 Mbit

8K,4K,16K,32K

512KX16

3 V

70 ns

FLASH

DATA RETENTION 20 YEARS TYPICAL AVAILABLE

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

YES

5 µA

12 µA

3.6 V

2.7 V

CMOS

YES

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

INFINEON TECHNOLOGIES AG

compliant

FBGA-48

Infineon

Check for Price

Yes

Transferred

8.3886 Mbit

8K,4K,16K,32K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

12 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

compliant

EAR99

8542.32.00.51

8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48

BGA

Compare

S29AL008J70BFI023

Cypress Semiconductor

$1.9400

Yes

Transferred

8.3886 Mbit

8K,4K,16K,32K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

12 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

S29AL008J70BFI023

Infineon Technologies AG

$2.0874

Yes

Active

8.3886 Mbit

8K,4K,16K,32K

512KX16

3 V

70 ns

FLASH

DATA RETENTION 20 YEARS TYPICAL AVAILABLE

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

YES

5 µA

12 µA

3.6 V

2.7 V

CMOS

YES

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

INFINEON TECHNOLOGIES AG

compliant

FBGA-48

Infineon

S29AL008J70BFI023

Spansion

Check for Price

Yes

Transferred

8.3886 Mbit

8K,4K,16K,32K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

12 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

compliant

EAR99

8542.32.00.51

8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48

BGA

Parametric results for: S29AL008J70BFI023 under Flash Memories