Findchips: Parametric Search Results for S29AL016J70BFI022


Select Parts		Part Number

		S29AL016J70BFI022 Cypress Semiconductor
		S29AL016J70BFI022 Infineon Technologies AG
		S29AL016J70BFI022 Spansion

				Most Relevant						Technical																									Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Package Description	Samacsys Manufacturer	Part Package Code	Pin Count

$1.7995

Yes

Transferred

16.7772 Mbit

16K,8K,32K,64K

1MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

$2.5006

Yes

Active

16.7772 Mbit

16K,8K,32K,64K

1MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,31

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

YES

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

INFINEON TECHNOLOGIES AG

compliant

FBGA-48

Infineon

Check for Price

Yes

Transferred

16.7772 Mbit

16K,8K,32K,64K

1MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

compliant

EAR99

8542.32.00.51

8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48

BGA

Compare

S29AL016J70BFI022

Cypress Semiconductor

$1.7995

Yes

Transferred

16.7772 Mbit

16K,8K,32K,64K

1MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

S29AL016J70BFI022

Infineon Technologies AG

$2.5006

Yes

Active

16.7772 Mbit

16K,8K,32K,64K

1MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,31

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

YES

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

INFINEON TECHNOLOGIES AG

compliant

FBGA-48

Infineon

S29AL016J70BFI022

Spansion

Check for Price

Yes

Transferred

16.7772 Mbit

16K,8K,32K,64K

1MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1,2,1,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

compliant

EAR99

8542.32.00.51

8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48

BGA

Parametric results for: S29AL016J70BFI022 under Flash Memories