Parametric results for: S29GL032M under Flash Memories

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Manufacturer Part Number: s29gl032m
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S29GL032M90BACR20
AMD
Check for Price No Transferred 33.5544 Mbit 16 64K 2MX16 90 ns FLASH 8 YES YES YES 64 2000000 2.0972 M 4/8 words PARALLEL YES 5 µA 60 µA CMOS COMMERCIAL YES NOR TYPE S-PBGA-B64 Not Qualified e0 70 °C 64 PLASTIC/EPOXY BGA BGA64,8X8,40 SQUARE GRID ARRAY YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM ADVANCED MICRO DEVICES INC unknown EAR99 8542.32.00.51
S29GL032M90TACR10
Spansion
Check for Price No Obsolete 33.5544 Mbit 16 64K 2MX16 3.3 V 90 ns FLASH 8 YES YES YES 1 64 2000000 2.0972 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 70 °C 260 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC not_compliant EAR99 8542.32.00.51 TSOP1 MO-142EC, TSOP-56 56
S29GL032M10BCIR33
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V 100 ns FLASH 8 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC compliant EAR99 8542.32.00.51 BGA LEAD FREE, BGA-48 48
S29GL032M10BCIR30
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V 100 ns FLASH 8 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC compliant EAR99 8542.32.00.51 BGA LEAD FREE, BGA-48 48
S29GL032M10BAIR63
Spansion
Check for Price No Obsolete 33.5544 Mbit 16 8K,64K 2MX16 3.3 V 100 ns FLASH BOTTOM BOOT BLOCK 8 BOTTOM YES YES YES 1 8,63 2000000 2.0972 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e0 3 85 °C -40 °C 260 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC not_compliant EAR99 8542.32.00.51 BGA 8 X 6 MM, BGA-48 48
S29GL032M90FACR42
Spansion
Check for Price No Obsolete 33.5544 Mbit 16 8K,64K 2MX16 3.3 V 90 ns FLASH BOTTOM BOOT BLOCK 8 BOTTOM YES YES YES 1 8,63 2000000 2.0972 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 70 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC not_compliant EAR99 8542.32.00.51 BGA 13 X 11 MM, FORTIFIED, BGA-64 64
S29GL032M11TFIR20
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 64K 2MX16 3.3 V 110 ns FLASH 8 YES YES YES 1 64 2000000 2.0972 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC unknown EAR99 8542.32.00.51 TSOP1 TSSOP, TSSOP56,.8,20 56
S29GL032M11BFIR13
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 64K 2MX16 3.3 V 110 ns FLASH 8 YES YES YES 1 64 2000000 2.0972 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC unknown EAR99 8542.32.00.51 BGA 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64 64
S29GL032M10BBIR33
AMD
Check for Price Transferred ADVANCED MICRO DEVICES INC unknown EAR99 8542.32.00.51
S29GL032M11BCIR4
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,64K 2MX16 3.3 V 110 ns FLASH 8 BOTTOM YES YES YES 8,63 2000000 2.0972 M 4/8 words PARALLEL YES 5 µA 60 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified 85 °C -40 °C 260 40 48 PLASTIC/EPOXY FBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SPANSION INC unknown EAR99 8542.32.00.51 FBGA, BGA48,6X8,32