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S29GL032M90BACR20
AMD
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Check for Price | No | Transferred | 33.5544 Mbit | 16 | 64K | 2MX16 | 90 ns | FLASH | 8 | YES | YES | YES | 64 | 2000000 | 2.0972 M | 4/8 words | PARALLEL | YES | 5 µA | 60 µA | CMOS | COMMERCIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | e0 | 70 °C | 64 | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||
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S29GL032M90TACR10
Spansion
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 64K | 2MX16 | 3.3 V | 90 ns | FLASH | 8 | YES | YES | YES | 1 | 64 | 2000000 | 2.0972 M | ASYNCHRONOUS | 4/8 words | PARALLEL | 3 V | YES | 5 µA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e0 | 3 | 70 °C | 260 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | not_compliant | EAR99 | 8542.32.00.51 | TSOP1 | MO-142EC, TSOP-56 | 56 | ||||||
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S29GL032M10BCIR33
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 100 ns | FLASH | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | compliant | EAR99 | 8542.32.00.51 | BGA | LEAD FREE, BGA-48 | 48 | |||||||||||||||||
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S29GL032M10BCIR30
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 100 ns | FLASH | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | compliant | EAR99 | 8542.32.00.51 | BGA | LEAD FREE, BGA-48 | 48 | |||||||||||||||||
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S29GL032M10BAIR63
Spansion
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 3.3 V | 100 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | 4/8 words | PARALLEL | 3 V | YES | 5 µA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | not_compliant | EAR99 | 8542.32.00.51 | BGA | 8 X 6 MM, BGA-48 | 48 | |||
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S29GL032M90FACR42
Spansion
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 3.3 V | 90 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | 4/8 words | PARALLEL | 3 V | YES | 5 µA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e0 | 3 | 70 °C | 260 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | not_compliant | EAR99 | 8542.32.00.51 | BGA | 13 X 11 MM, FORTIFIED, BGA-64 | 64 | ||||
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S29GL032M11TFIR20
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 64K | 2MX16 | 3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 64 | 2000000 | 2.0972 M | ASYNCHRONOUS | 4/8 words | PARALLEL | 3 V | YES | 5 µA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | TSOP1 | TSSOP, TSSOP56,.8,20 | 56 | ||||
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S29GL032M11BFIR13
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 64K | 2MX16 | 3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 64 | 2000000 | 2.0972 M | ASYNCHRONOUS | 4/8 words | PARALLEL | 3 V | YES | 5 µA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | BGA | 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64 | 64 | ||||
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S29GL032M10BBIR33
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29GL032M11BCIR4
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 3.3 V | 110 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 8,63 | 2000000 | 2.0972 M | 4/8 words | PARALLEL | YES | 5 µA | 60 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | FBGA, BGA48,6X8,32 |