Parametric results for: S70FL01GSDPBHIC10 under Flash Memories

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Manufacturer Part Number: s70fl01gsdpbhic10
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S70FL01GSDPBHIC10
Cypress Semiconductor
$13.8100 Yes Transferred 1.0737 Gbit 8 128MX8 3 V 66 MHz FLASH 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 200 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm CYPRESS SEMICONDUCTOR CORP BGA-24 compliant 3A991.B.1.A 8542.32.00.71
S70FL01GSDPBHIC10
Spansion
Check for Price Transferred 1.0737 Gbit 8 128MX8 3 V 66 MHz FLASH 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 200 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA-24 unknown EAR99 8542.32.00.51
S70FL01GSDPBHIC10
Infineon Technologies AG
Check for Price Yes Active 1.0737 Gbit 8 128MX8 3 V 66 MHz FLASH 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 200 µA 200 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm INFINEON TECHNOLOGIES AG BGA-24 compliant Infineon