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S70FL01GSDPBHIC10
Cypress Semiconductor
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$13.8100 | Yes | Transferred | 1.0737 Gbit | 8 | 128MX8 | 3 V | 66 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 200 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | BGA-24 | compliant | 3A991.B.1.A | 8542.32.00.71 | |||||
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S70FL01GSDPBHIC10
Spansion
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Check for Price | Transferred | 1.0737 Gbit | 8 | 128MX8 | 3 V | 66 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 200 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | BGA-24 | unknown | EAR99 | 8542.32.00.51 | ||||||||
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S70FL01GSDPBHIC10
Infineon Technologies AG
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Check for Price | Yes | Active | 1.0737 Gbit | 8 | 128MX8 | 3 V | 66 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 200 µA | 200 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INFINEON TECHNOLOGIES AG | BGA-24 | compliant | Infineon |