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Manufacturer Part Number: xczu4eg2fbvb900e

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	Part Number

XCZU4EG-2FBVB900E

AMD Xilinx

				Most Relevant			Technical				Compliance		Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

$1,683.5000

Yes

Transferred

YES

850 mV

MICROPROCESSOR CIRCUIT

CMOS

876 mV

825 mV

OTHER

R-PBGA-B900

100 °C

245

900

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

2.88 mm

31 mm

XILINX INC

BGA, BGA900,30X30,40

compliant

5A002.A.4

8542.39.00.01

2017-02-15