Parametric results for: ks156 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 72

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1.5 inch 48 1.6 inch 24

Min (inch) - Max (inch)

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0.015 inch 9 0.031 inch 27 0.095 inch 9 0.12 inch 9 0.13 inch 9 0.165 inch 9

Min (inch) - Max (inch)

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1.5 inch 48 1.6 inch 24

Min (inch) - Max (inch)

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15X15 48 16X16 24

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AU ON NI 10 GOLD OVER NICKEL 57 NOT SPECIFIED 7 SN-PB ON NI 4 TIN LEAD OVER NICKEL 26

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Gold (Au) - with Nickel (Ni) barrier 29 GOLD OVER NICKEL 35 Matte Tin (Sn) - with Nickel (Ni) barrier 6 TIN LEAD OVER NICKEL 29 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 54

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Contact Material (5)

BE-CU 16 BERYLLIUM COPPER 1 BERYLLIUM COPPER ALLOY 49 BERYLLIUM COPPER/COPPER ALLOY 24 BRASS 7

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RND PIN-SKT 72

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IC SOCKET 153

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DIP156 30 PGA156 123

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POLYAMIDE 31 POLYIMIDE 122

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e0 83 e3 6 e4 64

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Manufacturer (1)

Advanced Interconnections Corp 153

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0.1 inch 72

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STRAIGHT 72

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Number of Contacts (1)

156 153

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400.0 °C 72

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-269.0 °C 72

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RECTANGULAR 72

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100 µm 72

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Active 30 Obsolete 123

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No 12 Yes 12

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No 61 Yes 36

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Terminal Pitch (1)

2.54 mm 72

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SOLDER 72

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