Findchips: Parametric Search Results for mc33879apekr2


Select Parts		Part Number

		MC33879APEKR2 NXP Semiconductors
		MC33879APEK-R2 NXP Semiconductors
		MC33879APEKR2,518 NXP Semiconductors
		MC33879APEK-R2 Freescale Semiconductor

				Most Relevant							Technical											Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Input Characteristics	Output Characteristics	Driver Number of Bits	Output Peak Current Limit-Nom	Turn-off Time	Turn-on Time	Interface IC Type	Technology	Built-in Protections	Number of Functions	Output Current Flow Direction	Output Polarity	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	Samacsys Manufacturer	ECCN Code	HTS Code

$3.8417

Yes

Obsolete

5 V

STANDARD

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BCDMOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

R-PDSO-G32

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.65 mm

7.5 mm

NXP SEMICONDUCTORS

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

NXP

Check for Price

Yes

Obsolete

5 V

STANDARD

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BCDMOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

R-PDSO-G32

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.65 mm

7.5 mm

NXP SEMICONDUCTORS

HSSOP, SSOP32,.4

compliant

EAR99

8542.39.00.01

Check for Price

Obsolete

5 V

STANDARD

OPEN-DRAIN

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

AUTOMOTIVE

R-PDSO-G32

125 °C

-40 °C

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

SOIC-32

unknown

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

5 V

STANDARD

OPEN-DRAIN

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.65 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

SSOP, SSOP32,.4

compliant

EAR99

8542.39.00.01

Compare

MC33879APEKR2

NXP Semiconductors

$3.8417

Yes

Obsolete

5 V

STANDARD

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BCDMOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

R-PDSO-G32

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.65 mm

7.5 mm

NXP SEMICONDUCTORS

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

NXP

MC33879APEK-R2

NXP Semiconductors

Check for Price

Yes

Obsolete

5 V

STANDARD

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BCDMOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

R-PDSO-G32

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.65 mm

7.5 mm

NXP SEMICONDUCTORS

HSSOP, SSOP32,.4

compliant

EAR99

8542.39.00.01

MC33879APEKR2,518

NXP Semiconductors

Check for Price

Obsolete

5 V

STANDARD

OPEN-DRAIN

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

AUTOMOTIVE

R-PDSO-G32

125 °C

-40 °C

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

SOIC-32

unknown

EAR99

8542.39.00.01

MC33879APEK-R2

Freescale Semiconductor

Check for Price

Yes

Transferred

5 V

STANDARD

OPEN-DRAIN

1.2 A

100 µs

50 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

MOS

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SINK

TRUE

700 µA

5.5 V

3.1 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.65 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

SSOP, SSOP32,.4

compliant

EAR99

8542.39.00.01

Parametric results for: mc33879apekr2 under Peripheral Drivers