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KMPC8250ACVRIHBB
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 32 | 200 MHz | 64 | 32 | YES | MICROPROCESSOR, RISC | CMOS | REQUIRES 3.3V SUPPLY FOR I/O | YES | FIXED POINT | YES | 2.1 V | 1.7 V | COMMERCIAL | S-PBGA-B516 | Not Qualified | e0 | 70 °C | 516 | PLASTIC/EPOXY | BGA | BGA516,26X26,40 | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | MOTOROLA INC | BGA, BGA516,26X26,40 | unknown | 8542.31.00.01 | ||||||||||
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MPC8250ACVRIHBB
Motorola Semiconductor Products
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Check for Price | No | Transferred | 32 | 200 MHz | 64 | 32 | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | REQUIRES 3.3V SUPPLY FOR I/O | YES | FLOATING POINT | YES | 1.9 V | 1.7 V | S-PBGA-B516 | Not Qualified | e0 | 3 | 516 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | MOTOROLA INC | BGA, | unknown | 8542.31.00.01 | |||||||||||
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MPC8250ACVRIHBB
Motorola Mobility LLC
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Check for Price | Transferred | 32 | 200 MHz | 64 | 32 | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | REQUIRES 3.3V SUPPLY FOR I/O | YES | FLOATING POINT | YES | 1.9 V | 1.7 V | S-PBGA-B516 | Not Qualified | e0 | 3 | 516 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | MOTOROLA INC | BGA, | unknown | 8542.31.00.01 | BGA | 516 | ||||||||||
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KMPC8250ACVRIHBB
Freescale Semiconductor
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Check for Price | No | Obsolete | 32 | 300 MHz | YES | MICROPROCESSOR, RISC | 1.7/2.1,3.3 V | COMMERCIAL | S-PBGA-B516 | Not Qualified | e0 | 70 °C | 516 | PLASTIC/EPOXY | BGA | BGA516,26X26,40 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | MOTOROLA SEMICONDUCTOR PRODUCTS | BGA, BGA516,26X26,40 | unknown | ||||||||||||||||||||||
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KMPC8250ACVRIHBB
Motorola Mobility LLC
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Check for Price | No | Obsolete | 32 | 200 MHz | 64 | 32 | YES | MICROPROCESSOR, RISC | CMOS | REQUIRES 3.3V SUPPLY FOR I/O | YES | FIXED POINT | YES | 2.1 V | 1.7 V | COMMERCIAL | S-PBGA-B516 | Not Qualified | e0 | 70 °C | 516 | PLASTIC/EPOXY | BGA | BGA516,26X26,40 | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | MOTOROLA INC | BGA, BGA516,26X26,40 | unknown | 8542.31.00.01 | BGA | 516 | ||||||||
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MPC8250ACVRIHBB
Freescale Semiconductor
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Check for Price | Yes | Obsolete | 32 | 200 MHz | 64 | 32 | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | REQUIRES 3.3V SUPPLY FOR I/O | YES | FLOATING POINT | YES | 1.9 V | 1.7 V | S-PBGA-B516 | Not Qualified | e1 | 3 | 245 | 30 | 516 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, PLASTIC, BGA-516 | unknown | 8542.31.00.01 | BGA | 516 | NXP | ||||||
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MPC8250ACVRIHBB
Rochester Electronics LLC
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Check for Price | Active | 32 | 200 MHz | 64 | 32 | YES | 1.8 V | MICROPROCESSOR, RISC | REQUIRES 3.3V SUPPLY FOR I/O | YES | FLOATING POINT | YES | 1.9 V | 1.7 V | S-PBGA-B516 | COMMERCIAL | 3 | NOT SPECIFIED | NOT SPECIFIED | 516 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | NOT SPECIFIED | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | ROCHESTER ELECTRONICS INC | BGA, | unknown | BGA | 516 |