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Manufacturer Part Number: nx3l4684gm
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NX3L4684GM,115
NXP Semiconductors
$0.4380 Yes Active 1.65 V YES 900 mΩ 150 mΩ 130 ns 90 ns SPDT CMOS 1 2 90 dB SEPARATE OUTPUT 4.3 V 1.4 V BREAK-BEFORE-MAKE AUTOMOTIVE R-PQCC-N10 Not Qualified e4 1 125 °C -40 °C 260 30 10 PLASTIC/EPOXY VQCCN LCC10,.06X.08,20 RECTANGULAR CHIP CARRIER, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 2 mm 550 µm 1.55 mm NXP SEMICONDUCTORS QFN 2 X 1.50 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT1049-2, XQFN-10 10 SOT1049-3 compliant NXP
NX3L4684GM
NXP Semiconductors
Check for Price Yes Yes Active 1.65 V YES 900 mΩ 150 mΩ 130 ns 90 ns SPDT CMOS 1 2 90 dB SEPARATE OUTPUT 4.3 V 1.4 V BREAK-BEFORE-MAKE AUTOMOTIVE R-PQCC-N10 Not Qualified e4 1 125 °C -40 °C 260 30 10 PLASTIC/EPOXY HVQCCN LCC10,.06X.08,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 2 mm 550 µm 1.55 mm NXP SEMICONDUCTORS QFN HVQCCN, LCC10,.06X.08,20 10 compliant 8542.39.00.01
NX3L4684GM,132
NXP Semiconductors
Check for Price Yes Obsolete 1.65 V YES 1.7 Ω 150 mΩ 130 ns 90 ns CMOS 1 2 90 dB SEPARATE OUTPUT 4.3 V 1.4 V BREAK-BEFORE-MAKE AUTOMOTIVE R-PBCC-B10 Not Qualified e4 1 125 °C -40 °C 260 30 10 PLASTIC/EPOXY VBCC LCC10,.06X.08,20 RECTANGULAR CHIP CARRIER, VERY THIN PROFILE NICKEL PALLADIUM GOLD BUTT 500 µm BOTTOM 2 mm 500 µm 1.55 mm NXP SEMICONDUCTORS QFN XQFN-10 10 SOT1049-3 unknown 8542.39.00.01