Findchips: Parametric Search Results for xpc850zt66bu


Select Parts		Part Number

		XPC850ZT66BU NXP Semiconductors
		XPC850ZT66BU Freescale Semiconductor
		XPC850ZT66BU Motorola Semiconductor Products
		XPC850ZT66BU Rochester Electronics LLC
		XPC850ZT66BU Motorola Mobility LLC

			Most Relevant							Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count	ECCN Code

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Obsolete

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

OTHER

S-PBGA-B256

95 °C

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

NXP SEMICONDUCTORS

BGA-256

unknown

8542.31.00.01

Check for Price

Transferred

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

Not Qualified

220

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

FREESCALE SEMICONDUCTOR INC

23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256

not_compliant

8542.31.00.01

BGA

256

5A991

Check for Price

Transferred

66 MHz

33 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

Not Qualified

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

MOTOROLA INC

PLASTIC, BGA-256

unknown

8542.31.00.01

3A991.A.2

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Active

66 MHz

33 MHz

YES

3.3 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

COMMERCIAL

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

ROCHESTER ELECTRONICS INC

BGA,

unknown

BGA

256

Check for Price

Transferred

66 MHz

33 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

Not Qualified

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

MOTOROLA INC

BGA, BGA256,16X16,50

unknown

8542.31.00.01

BGA

256

3A991.A.2

Compare

XPC850ZT66BU

NXP Semiconductors

Check for Price

Obsolete

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

OTHER

S-PBGA-B256

95 °C

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

NXP SEMICONDUCTORS

BGA-256

unknown

8542.31.00.01

XPC850ZT66BU

Freescale Semiconductor

Check for Price

Transferred

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

Not Qualified

220

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

FREESCALE SEMICONDUCTOR INC

23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256

not_compliant

8542.31.00.01

BGA

256

5A991

XPC850ZT66BU

Motorola Semiconductor Products

Check for Price

Transferred

66 MHz

33 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

Not Qualified

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

MOTOROLA INC

PLASTIC, BGA-256

unknown

8542.31.00.01

3A991.A.2

XPC850ZT66BU

Rochester Electronics LLC

Check for Price

Active

66 MHz

33 MHz

YES

3.3 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

COMMERCIAL

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

ROCHESTER ELECTRONICS INC

BGA,

unknown

BGA

256

XPC850ZT66BU

Motorola Mobility LLC

Check for Price

Transferred

66 MHz

33 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B256

Not Qualified

256

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.35 mm

23 mm

MOTOROLA INC

BGA, BGA256,16X16,50

unknown

8542.31.00.01

BGA

256

3A991.A.2

Parametric results for: xpc850zt66bu under Microprocessors