1000BM2
vs
TLE8251VSJ
feature comparison
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
AT & T MICROELECTRONICS
|
INFINEON TECHNOLOGIES AG
|
Package Description |
,
|
SOP,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-J44
|
R-PDSO-G8
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
8
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Position |
QUAD
|
DUAL
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Date Of Intro |
|
2016-07-18
|
Samacsys Manufacturer |
|
Infineon
|
Length |
|
5 mm
|
Moisture Sensitivity Level |
|
2A
|
Package Code |
|
SOP
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
1.75 mm
|
Terminal Finish |
|
Nickel/Gold/Palladium (Ni/Au/Pd)
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
4 mm
|
|
|
|
Compare 1000BM2 with alternatives
Compare TLE8251VSJ with alternatives