1339-2DVGI8
vs
DS1339C-33#T&R
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
MSOP-8
|
SOP-16
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
DVG8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| External Data Bus Width |
|
|
| Information Access Method |
SERIAL(I2C)
|
SERIAL(I2C)
|
| Interrupt Capability |
Y
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
8
|
16
|
| Number of Timers |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
2.65 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.4 V
|
2.97 V
|
| Supply Voltage-Nom |
2 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time-Min |
SECONDS
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Volatile |
YES
|
|
| uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
| Base Number Matches |
2
|
2
|
| Length |
|
10.3 mm
|
| Width |
|
7.5 mm
|
|
|
|
Compare 1339-2DVGI8 with alternatives
Compare DS1339C-33#T&R with alternatives