1N1126AR
vs
JANTXV1N1126AR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SOLID STATE DEVICES INC
|
| Package Description |
GLASS METAL, DO-4, 1 PIN
|
HERMETIC SEALED PACKAGE-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
29 Weeks
|
|
| Application |
POWER
|
FAST RECOVERY
|
| Case Connection |
ANODE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-203AA
|
DO-4
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
25 A
|
50 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Output Current-Max |
3.3 A
|
3 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DO-4
|
| Pin Count |
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
LOW LEAKAGE CURRENT
|
| Reference Standard |
|
MIL-19500/104
|
| Reverse Recovery Time-Max |
|
5 µs
|
|
|
|