1N1127A
vs
1N1127AE3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
MICROSEMI CORP
|
| Part Package Code |
DO-4
|
|
| Package Description |
HERMETIC SEALED PACKAGE-1
|
GLASS METAL, DO203AA(DO4), 1 PIN
|
| Pin Count |
1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW LEAKAGE CURRENT
|
|
| Application |
FAST RECOVERY
|
POWER
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-4
|
DO-203AA
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
50 A
|
250 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Output Current-Max |
3 A
|
12 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
500 V
|
500 V
|
| Reverse Recovery Time-Max |
5 µs
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
6
|
1
|
| Case Connection |
|
CATHODE
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare 1N1127A with alternatives
Compare 1N1127AE3 with alternatives