1N3025B-1 vs 1N3025BB3 feature comparison

1N3025B-1 Microsemi Corporation

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1N3025BB3 STMicroelectronics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP STMICROELECTRONICS
Part Package Code DO-41
Package Description HERMETIC SEALED, GLASS PACKAGE-1 O-MALF-W2
Pin Count 1
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 16 Ω
JEDEC-95 Code DO-41 DO-13
JESD-30 Code O-LALF-W2 O-MALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS METAL
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 16 V 16 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 15.5 mA 15.5 mA
Base Number Matches 4 1
Knee Impedance-Max 700 Ω
Operating Temperature-Min -65 °C
Reverse Current-Max 5 µA
Voltage Temp Coeff-Max 11.2 mV/°C

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