1N3045B-1 vs JAN1N3045B-1 feature comparison

1N3045B-1 Microchip Technology Inc

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JAN1N3045B-1 Cobham PLC

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC COBHAM PLC
Package Description HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code compliant unknown
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 450 Ω
JEDEC-95 Code DO-41 DO-41
JESD-30 Code O-LALF-W2 O-XALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 110 V 110 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 2.3 mA 2.3 mA
Base Number Matches 4 8
ECCN Code EAR99
HTS Code 8541.10.00.50

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