1N3045B-1 vs MQ1GZ110D5E3 feature comparison

1N3045B-1 Microchip Technology Inc

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MQ1GZ110D5E3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-1 O-LALF-W2
Reach Compliance Code compliant unknown
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 450 Ω
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 150 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 110 V 110 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 2.3 mA 2.3 mA
Base Number Matches 4 1
Part Package Code DO-41
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Operating Temperature-Min -65 °C

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