1N3307
vs
1N3307RE3
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
SEMITRONICS CORP
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
0.4 Ω
|
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Reference Voltage-Nom |
8.2 V
|
8.2 V
|
| Surface Mount |
NO
|
NO
|
| Voltage Tol-Max |
20%
|
20%
|
| Working Test Current |
1500 mA
|
1500 mA
|
| Base Number Matches |
12
|
1
|
| Package Description |
|
O-MUPM-D1
|
| Additional Feature |
|
PD-CASE
|
| Case Connection |
|
CATHODE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-203AB
|
| JESD-30 Code |
|
O-MUPM-D1
|
| Number of Terminals |
|
1
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
POST/STUD MOUNT
|
| Polarity |
|
UNIDIRECTIONAL
|
| Technology |
|
ZENER
|
| Terminal Form |
|
SOLDER LUG
|
| Terminal Position |
|
UPPER
|
|
|
|
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