1N3779E3
vs
1N3779
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
INTERNATIONAL SEMICONDUCTOR INC
|
| Package Description |
O-XALF-W2
|
O-LALF-W2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-7
|
DO-35
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Power Dissipation-Max |
0.4 W
|
|
| Reference Voltage-Nom |
6.7 V
|
6.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Temp Coeff-Max |
1.005 mV/°C
|
0.975 mV/°C
|
| Voltage Tol-Max |
5%
|
3%
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DO-35
|
| Pin Count |
|
2
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1N3779E3 with alternatives
Compare 1N3779 with alternatives