1N3823A-1 vs MX1N4730APTR feature comparison

1N3823A-1 Microchip Technology Inc

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MX1N4730APTR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-PALF-W2
Reach Compliance Code compliant unknown
Factory Lead Time 14 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-LALF-W2 O-PALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.9 V 3.9 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 64 mA 64 mA
Base Number Matches 5 1
Part Package Code DO-41
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C

Compare 1N3823A-1 with alternatives

Compare MX1N4730APTR with alternatives