1N4481US
vs
JAN1N4481
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
| Reach Compliance Code |
compliant
|
|
| Factory Lead Time |
28 Weeks
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
|
| JESD-30 Code |
O-LELF-R2
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
1.5 W
|
|
| Reference Voltage-Nom |
47 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
5.5 mA
|
|
| Base Number Matches |
9
|
|
|
|
|
Compare 1N4481US with alternatives