1N4552B
vs
1N4560B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, METAL, DO-5, 1 PIN
|
TO-3, 2 PIN
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
35 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
HIGH RELIABILITY, LOW IMPEDANCE
|
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
0.12 Ω
|
|
| JEDEC-95 Code |
DO-203AB
|
TO-204AD
|
| JESD-30 Code |
O-MUPM-D1
|
O-MBFM-P2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
FLANGE MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
5.1 V
|
5.1 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Terminal Form |
SOLDER LUG
|
PIN/PEG
|
| Terminal Position |
UPPER
|
BOTTOM
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
2450 mA
|
2450 mA
|
| Base Number Matches |
4
|
6
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TO-3
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
|
|
|
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