1N4733APE3/TR8
vs
1N4733ATA
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ON SEMICONDUCTOR
|
| Package Description |
DO-41, 2 PIN
|
O-LALF-W2
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
7 Ω
|
7 Ω
|
| JEDEC-95 Code |
DO-204AL
|
DO-41
|
| JESD-30 Code |
O-PALF-W2
|
O-LALF-W2
|
| Knee Impedance-Max |
550 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Reference Standard |
MIL-STD-750
|
|
| Reference Voltage-Nom |
5.1 V
|
5.1 V
|
| Reverse Current-Max |
10 µA
|
|
| Reverse Test Voltage |
1 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
49 mA
|
49 mA
|
| Base Number Matches |
2
|
4
|
| Part Package Code |
|
DO-41
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
CASE 59-10
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare 1N4733APE3/TR8 with alternatives
Compare 1N4733ATA with alternatives