1N4733ATA
vs
BZV85-C5V1
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
O-LALF-W2
|
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
CAPACITANCE IS CAPTURED FROM THE GRAPH
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-41
|
DO-41
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| Knee Impedance-Max |
550 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
5.1 V
|
5.1 V
|
| Reverse Current-Max |
10 µA
|
3 µA
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
49 mA
|
45 mA
|
| Base Number Matches |
4
|
5
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DO-41
|
| Pin Count |
|
2
|
| Dynamic Impedance-Max |
|
10 Ω
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reference Standard |
|
CECC50005-010
|
| Terminal Finish |
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Voltage Temp Coeff-Max |
|
2.2 mV/°C
|
|
|
|
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