1N5221CD7E3 vs MSP1N5221C feature comparison

1N5221CD7E3 Microsemi Corporation

Buy Now Datasheet

MSP1N5221C Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-XALF-W2 O-LALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-XALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Reference Voltage-Nom 2.4 V 2.4 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 20 mA 20 mA
Base Number Matches 1 15
Pbfree Code No
Rohs Code No
Part Package Code DO-7
Pin Count 2
JEDEC-95 Code DO-204AA
JESD-609 Code e0
Qualification Status Not Qualified
Terminal Finish TIN LEAD

Compare 1N5221CD7E3 with alternatives

Compare MSP1N5221C with alternatives