1N5226B
vs
CDLL4684E3
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS, DO-35, 2 PIN
|
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
14 Weeks
|
14 Weeks
|
Samacsys Manufacturer |
Microchip
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-204AH
|
DO-213AA
|
JESD-30 Code |
O-LALF-W2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.48 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WIRE
|
WRAP AROUND
|
Terminal Position |
AXIAL
|
END
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
20 mA
|
0.05 mA
|
Base Number Matches |
3
|
2
|
Additional Feature |
|
METALLURGICALLY BONDED
|
|
|
|
Compare 1N5226B with alternatives
Compare CDLL4684E3 with alternatives