1N5257BRA1 vs 1N5257B-1 feature comparison

1N5257BRA1 Tak Cheong Electronics (Holdings) Co Ltd

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1N5257B-1 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TAK CHEONG ELECTRONICS HOLDINGS CO LTD MICROSEMI CORP
Part Package Code DO-204 DO-35
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 58 Ω 58 Ω
JEDEC-95 Code DO-35 DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 250
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3.8 mA 3.8 mA
Base Number Matches 1 21
Pbfree Code No
JESD-609 Code e0
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

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