1N5261BRA1 vs 1N5261BD7 feature comparison

1N5261BRA1 Tak Cheong Electronics (Holdings) Co Ltd

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1N5261BD7 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TAK CHEONG ELECTRONICS HOLDINGS CO LTD MICROSEMI CORP
Part Package Code DO-204
Package Description O-LALF-W2 O-XALF-W2
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 105 Ω
JEDEC-95 Code DO-35
JESD-30 Code O-LALF-W2 O-XALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 47 V 47 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 2.7 mA 2.7 mA
Base Number Matches 2 1
JESD-609 Code e0
Knee Impedance-Max 1000 Ω
Operating Temperature-Min -65 °C
Reverse Current-Max 0.1 µA
Terminal Finish TIN LEAD
Voltage Temp Coeff-Max 44.65 mV/°C

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