1N5264B vs MX1N3038CUR-1 feature comparison

1N5264B Tak Cheong Electronics (Holdings) Co Ltd

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MX1N3038CUR-1 Microsemi Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TAK CHEONG ELECTRONICS HOLDINGS CO LTD MICROSEMI CORP
Part Package Code DO-35 DO-213AB
Package Description ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN HERMETIC SEALED, LEADLESS, GLASS, MELF-2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 170 Ω
JEDEC-95 Code DO-204AH DO-213AB
JESD-30 Code O-LALF-W2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 250
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 60 V 56 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Tol-Max 5% 2%
Working Test Current 2.1 mA 4.5 mA
Base Number Matches 9 4
JESD-609 Code e0
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

Compare 1N5264B with alternatives

Compare MX1N3038CUR-1 with alternatives