1N5268B vs MQ1N5268B-1 feature comparison

1N5268B Microchip Technology Inc

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MQ1N5268B-1 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, DO-35, 2 PIN O-LALF-W2
Reach Compliance Code compliant compliant
Factory Lead Time 14 Weeks
Samacsys Manufacturer Microchip
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.48 W
Reference Voltage-Nom 82 V 82 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 1.5 mA 1.5 mA
Base Number Matches 3 4
Pbfree Code No
Part Package Code DO-35
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Reference Standard MIL-19500

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