1N5533B vs JANTXV1N5533B-1 feature comparison

1N5533B Microchip Technology Inc

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JANTXV1N5533B-1 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETICALLY SEALED, GLASS PACKAGE-2 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 90 Ω
JEDEC-95 Code DO-35 DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/437E MIL-19500
Reference Voltage-Nom 13 V 13 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 1 mA 1 mA
Base Number Matches 12 2
Pbfree Code No
Part Package Code DO-7
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50

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