1N5711E3
vs
JAN1N5711
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
COMPENSATED DEVICES INC
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
24 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-35
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| Number of Elements |
1
|
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
0.033 A
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Surface Mount |
NO
|
|
| Technology |
SCHOTTKY
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Base Number Matches |
1
|
3
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1N5711E3 with alternatives
Compare JAN1N5711 with alternatives