1N5806
vs
JANHCB1N5806
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, GLASS, 106, 2 PIN
|
S-XXUC-N2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.40
|
| Factory Lead Time |
20 Weeks
|
|
| Date Of Intro |
1997-01-01
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Application |
ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY POWER
|
| Case Connection |
ISOLATED
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.875 V
|
0.875 V
|
| JESD-30 Code |
E-LALF-W2
|
S-XXUC-N2
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
35 A
|
35 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
2.5 A
|
2.5 A
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ELLIPTICAL
|
SQUARE
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Recovery Time-Max |
0.025 µs
|
0.025 µs
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
NO LEAD
|
| Terminal Position |
AXIAL
|
UNSPECIFIED
|
| Base Number Matches |
21
|
1
|
| Part Package Code |
|
DIE
|
| Reference Standard |
|
MIL-19500/477F
|
|
|
|
Compare 1N5806 with alternatives
Compare JANHCB1N5806 with alternatives