1N5822-T
vs
1N5822
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| Samacsys Manufacturer |
MCC
|
Microchip
|
| JESD-609 Code |
e0
|
e0
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
6
|
16
|
| Package Description |
|
HERMETIC SEALED, GLASS, B PACKAGE-2
|
| Factory Lead Time |
|
24 Weeks
|
| Application |
|
GENERAL PURPOSE
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
|
0.7 V
|
| JESD-30 Code |
|
O-LALF-W2
|
| Non-rep Pk Forward Current-Max |
|
80 A
|
| Number of Elements |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Output Current-Max |
|
3 A
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Rep Pk Reverse Voltage-Max |
|
40 V
|
| Reverse Current-Max |
|
100 µA
|
| Surface Mount |
|
NO
|
| Technology |
|
SCHOTTKY
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
Compare 1N5822-T with alternatives
Compare 1N5822 with alternatives