1N5822-T
vs
JAN1N5822
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
MCC
|
Microsemi Corporation
|
| JESD-609 Code |
e0
|
e0
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
6
|
3
|
| Pbfree Code |
|
No
|
| Package Description |
|
HERMETIC SEALED PACKAGE-2
|
| Pin Count |
|
2
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Application |
|
GENERAL PURPOSE
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| JESD-30 Code |
|
O-XALF-W2
|
| Non-rep Pk Forward Current-Max |
|
80 A
|
| Number of Elements |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Output Current-Max |
|
3 A
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
MIL-19500/620E
|
| Surface Mount |
|
NO
|
| Technology |
|
SCHOTTKY
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
Compare 1N5822-T with alternatives
Compare JAN1N5822 with alternatives