1N6345
vs
JANHCB1N6345
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
SENSITRON SEMICONDUCTOR
|
Package Description |
MICRO MINIATURE, GLASS PACKAGE-2
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
180 Ω
|
180 Ω
|
JEDEC-95 Code |
DO-35
|
|
JESD-30 Code |
O-LALF-W2
|
S-XUUC-N1
|
JESD-609 Code |
e0
|
|
Knee Impedance-Max |
1600 Ω
|
1600 Ω
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
1
|
Operating Temperature-Max |
200 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-55 °C
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
75 V
|
75 V
|
Reverse Current-Max |
0.05 µA
|
0.05 µA
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD OVER NICKEL
|
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Voltage Temp Coeff-Max |
73.5 mV/°C
|
77.25 mV/°C
|
Voltage Tol-Max |
5%
|
|
Working Test Current |
1.7 mA
|
1.7 mA
|
Base Number Matches |
36
|
1
|
Reference Standard |
|
MIL-PRF-19500
|
|
|
|
Compare 1N6345 with alternatives
Compare JANHCB1N6345 with alternatives