1N6622
vs
1N6622
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
HERMETIC SEALED, GLASS, A, 2 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
LOW LEAKAGE CURRENT
|
HIGH RELIABILITY
|
| Application |
ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.6 V
|
1.6 V
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| Non-rep Pk Forward Current-Max |
20 A
|
20 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Output Current-Max |
2 A
|
1.2 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Recovery Time-Max |
0.03 µs
|
0.045 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
2
|
12
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
24 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
0.5 µA
|
| Technology |
|
AVALANCHE
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 1N6622 with alternatives
Compare 1N6622 with alternatives