1N758
vs
MQ1N758
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
17 Ω
JEDEC-95 Code
DO-35
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.417 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
10 V
10 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
10%
10%
Working Test Current
20 mA
20 mA
Base Number Matches
34
16
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Category CO2 Kg
8.7
Compliance Temperature Grade
Military: -65C to +175C
Compare 1N758 with alternatives
Compare MQ1N758 with alternatives