1N825E3
vs
1N825
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
| Package Description |
DIE-3
|
HERMETIC SEALED PACKAGE-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
26 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-204AH
|
DO-35
|
| JESD-30 Code |
S-XXSS-N3
|
O-XALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
2
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
SPECIAL SHAPE
|
LONG FORM
|
| Power Dissipation-Max |
0.475 W
|
0.5 W
|
| Reference Voltage-Nom |
6.2 V
|
6.2 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UNSPECIFIED
|
AXIAL
|
| Voltage Temp Coeff-Max |
0.124 mV/°C
|
0.124 mV/°C
|
| Voltage Tol-Max |
4.84%
|
4.84%
|
| Base Number Matches |
2
|
28
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 1N825E3 with alternatives
Compare 1N825 with alternatives