1N971TR
vs
1N972A-1E3/TR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-609 Code |
e0
|
e3
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Base Number Matches |
1
|
6
|
| Package Description |
|
O-LALF-W2
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Dynamic Impedance-Max |
|
49 Ω
|
| JEDEC-95 Code |
|
DO-204AA
|
| JESD-30 Code |
|
O-LALF-W2
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
175 °C
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Polarity |
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
|
0.417 W
|
| Qualification Status |
|
Not Qualified
|
| Reference Voltage-Nom |
|
30 V
|
| Surface Mount |
|
NO
|
| Technology |
|
ZENER
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
| Voltage Tol-Max |
|
10%
|
| Working Test Current |
|
4.2 mA
|
|
|
|
Compare 1N971TR with alternatives
Compare 1N972A-1E3/TR with alternatives