1N973B(DO7) vs 1N973BTR feature comparison

1N973B(DO7) Microsemi Corporation

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1N973BTR Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code DO-7
Package Description O-XALF-W2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-7 DO-204AA
JESD-30 Code O-XALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3.8 mA 3.8 mA
Base Number Matches 1 4
Dynamic Impedance-Max 58 Ω
Knee Impedance-Max 1000 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-STD-750
Reverse Current-Max 5 µA
Reverse Test Voltage 25.1 V
Voltage Temp Coeff-Max 30.36 mV/°C

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