21150-BC
vs
PCI6150-BB66PCG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
PLX TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
FQFP, QFP208,1.2SQ,20
|
FQFP,
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Clock Frequency-Max |
66 MHz
|
66 MHz
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
| Length |
28 mm
|
28 mm
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.75 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare 21150-BC with alternatives
Compare PCI6150-BB66PCG with alternatives