21281DB vs IDT79RC32V364133DAI feature comparison

21281DB Intel Corporation

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IDT79RC32V364133DAI Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LFQFP, QFP144,.87SQ,20 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
Pin Count 144 144
Reach Compliance Code unknown compliant
Factory Lead Time 4 Weeks
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166 MHz 133 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-PQFP-G144 S-PQFP-G144
Length 20 mm 20 mm
Low Power Mode YES YES
Number of Terminals 144 144
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP144,.87SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Power Supplies 2,3.3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.6 mm
Speed 166 MHz 133 MHz
Supply Voltage-Max 1.815 V 3.465 V
Supply Voltage-Min 1.485 V 3.135 V
Supply Voltage-Nom 1.65 V 3.3 V
Surface Mount YES YES
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 20

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