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Part Number Composite Price
Rohs Code
Part Life Cycle Code
Bit Size Speed RAM (words) External Data Bus Width
Address Bus Width Clock Frequency-Max
Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
Technology Additional Feature
Boundary Scan
Format
Integrated Cache
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Number of External Interrupts Power Supplies
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Supply Voltage-Max
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JESD-30 Code
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JESD-609 Code
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Operating Temperature-Min
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Package Code
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Package Shape
Package Style
Terminal Finish
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Terminal Pitch
Terminal Position
Seated Height-Max
Width
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Part Package Code
Package Description
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Reach Compliance Code
ECCN Code
HTS Code
MPC603CQ50
Motorola Mobility LLC
Check for Price Obsolete 32 50 MHz 0 64 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS 5 EXECUTION UNITS; 4 PIPELINE STAGES; BURST BUS; PHASE-LOCKED LOOP MULTIPLIER YES FLOATING POINT NO YES 2 3.6 V 3 V S-GQFP-G240 Not Qualified 240 CERAMIC, GLASS-SEALED FQFP SQUARE FLATPACK, FINE PITCH GULL WING 500 µm QUAD 4.3 mm 31.305 mm 31.305 mm QFP FQFP, 240 unknown 3A991.A.2 8542.31.00.01
D550APQ1A
AMD
Check for Price Obsolete 32 550 MHz 64 15 100 MHz NO 1.7 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES R-CPGA-P462 Not Qualified 462 CERAMIC, METAL-SEALED COFIRED IPGA RECTANGULAR GRID ARRAY, INTERSTITIAL PITCH PIN/PEG 2.54 mm PERPENDICULAR 3.422 mm 49.53 mm 49.53 mm PGA IPGA, 453 unknown 3A991.A.2 8542.31.00.01
P4080FE3NKAC
e2v technologies
Check for Price Obsolete 1.333 GHz 64 16 133.3 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 970 mV AUTOMOTIVE S-PBGA-B1295 e1 125 °C -40 °C 1295 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 3.53 mm 37.5 mm 37.5 mm 37.50 X 37.50 MM, 3.53 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-1295 compliant 3A991.A.2 8542.31.00.01
P4081FN7PMB
e2v technologies
Check for Price Obsolete 1.5 GHz 64 16 133.3 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.05 V 950 mV AUTOMOTIVE S-PBGA-B1295 e1 125 °C -40 °C 1295 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 3.53 mm 37.5 mm 37.5 mm 37.50 X 37.50 MM, 3.53 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1295 compliant 3A991.A.2 8542.31.00.01
PC7410VGSU500NE
e2v technologies
Check for Price Obsolete 32 500 MHz 64 32 133 MHz YES 1.5 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.5,1.8/2.5 V 1.55 V 1.45 V S-CBGA-B360 Not Qualified 360 CERAMIC, METAL-SEALED COFIRED BGA CGA360,19X19,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 4.2 mm 25 mm 25 mm BGA BGA, CGA360,19X19,50 360 unknown 3A991.A.2 8542.31.00.01
KDINTEL386DX25
Intel Corporation
Check for Price Active 32 25 MHz 0 32 32 50 MHz YES 5 V MICROPROCESSOR CMOS DYNAMIC DATA BUS SIZING; EMULATION HARDW... more NO FIXED POINT NO NO 2 320 mA 5.25 V 4.75 V OTHER S-PQFP-G132 Not Qualified 100 °C 132 PLASTIC/EPOXY BQFP SQUARE FLATPACK, BUMPER GULL WING 635 µm QUAD 4.32 mm 24.13 mm 24.13 mm QFP BQFP, 132 compliant 3A991.A.2 8542.31.00.01
XPC604DIP266E
Motorola Mobility LLC
Check for Price Obsolete 32 266 MHz 64 32 266 MHz NO 2.6 V MICROPROCESSOR, RISC CMOS ALSO REQUIRES 3.3 TO 3.465 VOLTS FOR I/O OPERATION YES YES 2.73 V R-CPGA-P288 Not Qualified 288 CERAMIC, METAL-SEALED COFIRED PGA RECTANGULAR GRID ARRAY PIN/PEG 2.54 mm PERPENDICULAR 44.704 mm 63.881 mm PGA PGA, 288 unknown 3A991.A.2 8542.31.00.01
MPC604ERX166
Motorola Semiconductor Products
Check for Price No Obsolete 32 166 MHz 64 32 166.67 MHz YES 2.5 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT NO YES 2.5/3.3 V 2.625 V 2.375 V S-CBGA-B256 Not Qualified e0 256 CERAMIC, METAL-SEALED COFIRED BGA BGA255,16X16,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 3.2 mm 21 mm 21 mm 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-256 unknown 3A991.A.2 8542.31.00.01
A1100AMT3B
AMD
Check for Price Obsolete 32 1.1 GHz 64 13 133 MHz NO 1.75 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.75,2.5 V 34 A 1.85 V 1.65 V S-CPGA-P453 Not Qualified 453 CERAMIC, METAL-SEALED COFIRED PGA SPGA462,37X37 SQUARE GRID ARRAY PIN/PEG 2.54 mm PERPENDICULAR 3.43 mm 49.525 mm 49.525 mm PGA PGA, SPGA462,37X37 453 compliant 3A991.A.2 8473.30.11.80
IBM25PPC740L-GB366A2R
IBM
Check for Price No Contact Manufacturer 32 366 MHz 64 32 100 MHz YES 2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 2,1.8/3.3,2.5/3.3 V S-CBGA-B255 Not Qualified e0 255 CERAMIC, METAL-SEALED COFIRED BGA BGA255,16X16,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 3 mm 21 mm 21 mm BGA BGA, BGA255,16X16,50 255 unknown 3A991.A.2 8542.31.00.01

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